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MPC875CVR133 数据表(PDF) 79 Page - Freescale Semiconductor, Inc |
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MPC875CVR133 数据表(HTML) 79 Page - Freescale Semiconductor, Inc |
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79 / 84 page  MPC875/MPC870 PowerQUICC™ Hardware Specifications, Rev. 4 Freescale Semiconductor 79 Mechanical Data and Ordering Information 16.2 Mechanical Dimensions of the PBGA Package Figure 70 shows the mechanical dimensions of the PBGA package. . Figure 70. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package Note: Solder sphere composition is 95.5%Sn 45%Ag 0.5%Cu for MPC875/MPC870VRXXX. Solder sphere composition is 62%Sn 36%Pb 2%Ag for MPC875/MPC870ZTXXX. 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M—1994. 3. MAXIMUM SOLDER BALL DIAMETER MEASURED PARALLEL TO DATUM A. 4. DATUM A, THE SEATING PLANE, IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. NOTES: |
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