Data Sheet

ADP3335

Rev. C | Page 5 of 16

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

ADP3335

TOP VIEW

(Not to Scale)

OUT

1

OUT

2

OUT

3

GND

4

IN

IN

SD

NR

8

7

6

5

Figure 3. 8-Lead MSOP

SD

1

2

3

4

7

8

6

5

TOP VIEW

(Not to Scale)

OUT

OUT

GND

IN

IN

NR

ADP3335

OUT

NOTES

1. THE EXPOSED PAD ON THE BOTTOM OF THE PACKAGE

ENHANCES THE THERMAL PERFORMANCE AND IS

ELECTRICALLY CONNECTED TO DIE SUBSTRATE.

THERMAL VIAS MUST BE ISOLATED OR CONNECTED

TO IN. DO NOT CONNECT THE THERMAL PAD TO

GROUND.

Figure 4. 8-Lead LFCSP

Table 3. Pin Function Descriptions

Pin No.

Mnemonic

Function

1, 2, 3

OUT

Output of the Regulator. Bypass to ground with a 1.0 µF or larger capacitor. All pins must be connected together

for proper operation.

4

GND

Ground Pin.

5

NR

Noise Reduction Pin. Used for further reduction of output noise (see the Noise Reduction section for further

details).

6

SD

Active Low Shutdown Pin. Connect to ground to disable the regulator output. When shutdown is not used, this

pin should be connected to the input pin.

7, 8

IN

Regulator Input. All pins must be connected together for proper operation.

EP

Exposed

Pad

The exposed pad on the bottom of the LFCSP package enhances thermal performance and is electrically

connected to the die substrate, which is electrically common with the input pins, IN (Pin 7 and Pin 8), inside the

package.