ADP3335

Data Sheet

Rev. C | Page 12 of 16

OUTLINE DIMENSIONS

1

EXPOSED

PAD

(BOTTOM VIEW)

0.50

BSC

PIN 1

INDICATOR

0.50

0.40

0.30

TOP

VIEW

12° MAX

0.70 MAX

0.65 TYP

0.90 MAX

0.85 NOM

0.05 MAX

0.01 NOM

0.20 REF

1.89

1.74

1.59

4

1.60

1.45

1.30

3.25

3.00 SQ

2.75

2.95

2.75 SQ

2.55

5

8

PIN 1

INDICATOR

SEATING

PLANE

0.30

0.23

0.18

0.60 MAX

0.60 MAX

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 26. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]

3 mm × 3 mm Body, Very Thin, Dual Lead

(CP-8-2)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MO-187-AA

6°

0°

0.80

0.55

0.40

4

8

1

5

0.65 BSC

0.40

0.25

1.10 MAX

3.20

3.00

2.80

COPLANARITY

0.10

0.23

0.09

3.20

3.00

2.80

5.15

4.90

4.65

PIN 1

IDENTIFIER

15° MAX

0.95

0.85

0.75

0.15

0.05

Figure 27. 8-Lead Mini Small Outline Package [MSOP]

(RM-8)

Dimensions shown in millimeters