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VND830ASP 数据表(PDF) 13 Page - STMicroelectronics |
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VND830ASP 数据表(HTML) 13 Page - STMicroelectronics |
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13 / 17 page ![]() 13/17 VND830ASP PowerSO-10™ PC Board Rthj-amb Vs PCB copper area in open box free air condition PowerSO-10™ THERMAL DATA Layout condition of Rth and Zth measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm, Cu thickness=35 µm, Copper areas: from minimum pad lay-out to 8cm2). 30 35 40 45 50 55 024 68 10 PCB Cu heatsink area (cm^2) RTHj_amb (°C/W) Tj-Tamb=50°C |
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