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STF21N65M5 数据表(PDF) 3 Page - STMicroelectronics |
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STF21N65M5 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 22 page ![]() STB/F/I/P/W21N65M5 Electrical ratings Doc ID 15427 Rev 4 3/22 1 Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit TO-220, I²PAK, D²PAK, TO-247 TO-220FP VGS Gate-source voltage ± 25 V ID Drain current (continuous) at TC = 25 °C 17 17 (1) 1. Limited only by maximum temperature allowed. A ID Drain current (continuous) at TC = 100 °C 10.7 10.7 (1) A IDM (2) 2. Pulse width limited by safe operating area. Drain current (pulsed) 68 68(1) A PTOT Total dissipation at TC = 25 °C 125 30 W IAR Avalanche current, repetitive or not- repetitive (pulse width limited by Tj max) 5A EAS Single pulse avalanche energy (starting Tj = 25 °C, ID = IAR, VDD = 50 V) 400 mJ dv/dt (3) 3. ISD ≤ 17 A, di/dt ≤ 400 A/µs; VPeak < V(BR)DSS, VDD = 400 V. Peak diode recovery voltage slope 15 V/ns VISO Insulation withstand voltage (RMS) from all three leads to external heat sink (t = 1 s; TC = 25 °C) 2500 V Tstg Storage temperature - 55 to 150 °C Tj Max. operating junction temperature 150 °C Table 3. Thermal data Symbol Parameter Value Unit D²PAK I²PAK TO-220 TO-247 TO-220FP Rthj-case Thermal resistance junction-case max 14.17 °C/W Rthj-amb Thermal resistance junction- ambient max 62.5 50 62.5 °C/W Rthj-pcb Thermal resistance junction-pcb max 30 °C/W Tl Maximum lead temperature for soldering purpose 300 °C |
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