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ADR435 数据表(PDF) 19 Page - Analog Devices |
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ADR435 数据表(HTML) 19 Page - Analog Devices |
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19 / 24 page ![]() Data Sheet AD5601/AD5611/AD5621 Rev. G | Page 19 of 24 USING THE AD5601/AD5611/AD5621 WITH A GALVANICALLY ISOLATED INTERFACE In process control applications in industrial environments, it is often necessary to use a galvanically isolated interface to protect and isolate the controlling circuitry from any hazardous common-mode voltages that might occur in the area where the DAC is functioning. iCoupler® provides isolation in excess of 2.5 kV. Because the AD5601/AD5611/AD5621 use a 3-wire serial logic interface, the ADuM1300 3-channel digital isolator provides the required isolation (see Figure 53). The power supply to the part also needs to be isolated, which is done by using a transformer. On the DAC side of the transformer, a 5 V regulator provides the 5 V supply required for the AD5601/ AD5611/AD5621. Figure 53. AD5601/AD5611/AD5621 with a Galvanically Isolated Interface POWER SUPPLY BYPASSING AND GROUNDING When accuracy is important in a circuit, it is helpful to carefully consider the power supply and ground return layout on the board. The PCB containing the AD5601/AD5611/AD5621 should have separate analog and digital sections, each having its own area of the board. If the AD5601/AD5611/AD5621 are in a system where other devices require an AGND-to-DGND connection, the connection should be made at one point only. This ground point should be as close as possible to the AD5601/AD5611/AD5621. The power supply to the AD5601/AD5611/AD5621 should be bypassed with 10 µF and 0.1 µF capacitors. The capacitors should be physically as close as possible to the device, with the 0.1 µF capacitor ideally right up against the device. The 10 µF capacitors are the tantalum bead type. It is important that the 0.1 µF capacitor have low effective series resistance (ESR) and effective series inductance (ESI), such as in common ceramic types of capacitors. This 0.1 µF capacitor provides a low imped- ance path to ground for high frequencies caused by transient currents due to internal logic switching. The power supply line itself should have as large a trace as possible to provide a low impedance path and reduce glitch effects on the supply line. Clocks and other fast switching digital signals should be shielded from other parts of the board by digital ground. Avoid crossover of digital and analog signals, if possible. When traces cross on opposite sides of the board, ensure that they run at right angles to each other to reduce feedthrough effects on the board. The best board layout tech- nique is the microstrip technique, where the component side of the board is dedicated to the ground plane only and the signal traces are placed on the solder side. However, this is not always possible with a two-layer board. VDD AD5601/ AD5611/ AD5621 ADuM1300 POWER 10µF 0.1µF GND 5V REGULATOR SCLK VOA VOUT VOB SYNC VOC VIA VIB VIC SCLK SDI DATA SDIN |
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