P16E.pdf

Jul.15,2011

3

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.

qProduct ID

wFrequency/Capacitance

eStructure/Size

tDesign

oPackaging

CERALOCKr (MHz)

CS

Ceramic Resonators

Gpp

T/Vpp

Xpp

A

T

MHz with No capacitance built-in

MHz with Built-in Capacitance

LS

CC

CR/CE/CG

CV

CW

Round Lead Type

Cap Chip Type

Small-cap Chip Type

Monolithic Chip Type

Small Monolithic Chip Type

Thickness Shear mode

Thickness Expander mode

Thickness Expander mode (3rd overtone)

Three-digit alphanumerics express

"Individual Specification".

Structure/Size

-B0

-A0

-R0

-R1

Packaging

Product ID

Code

Code

Code

iIndividual Specification

***

Code

Frequency/Capacitance

Design

Individual Specification

Code

(Part Number)

rNominal Center Frequency

Expressed by four-digit alphanumerics. The unit is in hertz (Hz).

Decimal point is expressed by capital letter "

M".

With standard products, "

iIndividual Specification" is omitted.

Bulk

Plastic Taping ø=180mm

Plastic Taping ø=330mm

yInitial Frequency Tolerance

5

3

2

1

H

Design

Code

±0.5%

±0.3%

±0.2%

±0.1%

±0.07%

uLoad Capacity

1

2

3

4

5

6

Design

Code

5/6pF

10pF

15pF

22pF

30/33/39pF

47pF

e

CE

w

T

r

16M0

q

CS

pp indicates initial frequency tolerance and load capacity.

Radial taping is applied to lead type and plastic taping to chip type.

i

***

t

V

y

5

u

3

o

-R0