ADP124/ADP125

Data Sheet

Rev. C | Page 16 of 20

PRINTED CIRCUIT BOARD LAYOUT

CONSIDERATIONS

Heat dissipation from the package can be improved by increasing

the amount of copper attached to the pins of the ADP124/ADP125.

However, as shown in Table 6, a point of diminishing returns

eventually is reached, beyond which an increase in the copper

size does not yield significant heat dissipation benefits.

The input capacitor should be placed as close as possible to the

VIN and GND pins, and the output capacitor should be placed

as close as possible to the VOUT and GND pins. Use of 0402 or

0603 size capacitors and resistors achieves the smallest possible

footprint solution on boards where the area is limited.

Figure 42. Example ADP124 MSOP PCB Layout

Figure 43. Example ADP125 MSOP PCB Layout

Figure 44. Example ADP124/ADP125 LFCSP PCB Layout