SL3ICS1002FUG datasheet(12/51 Pages) NXP

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139037

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Product data sheet

COMPANY PUBLIC

Rev. 3.7 — 9 October 2012

139037

12 of 51

NXP Semiconductors

SL3ICS1002/1202

UCODE G2XM and G2XL

Limiting values

[1]

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at these or any conditions other

than those described in the Operating Conditions and Electrical Characteristics section of this specification

is not implied.

[2]

This product includes circuitry specifically designed for the protection of its internal devices from the

damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be

taken to avoid applying greater than the rated maxima.

[3]

For ESD measurement, the die chip has been mounted into a CDIP20 package.

Table 7.

Limiting values[1][2]

In accordance with the Absolute Maximum Rating System (IEC 60134)

Voltages are referenced to RFN

Symbol

Parameter

Conditions

Min

Max

Unit

Die

Tstg

storage temperature range

-55

+125

C

Toper

operating temperature

-40

+85

C

VESD

electrostatic discharge voltage

Human body model

[3]

 2kV

TSSOP8, SOT1122

Tstg

storage temperature range

-55

+125

C

Ptot

total power dissipation

Toper

operating temperature

-40

+85

C

VESD

electrostatic discharge voltage

Human body model

 2kV

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