DAC08

Rev. C | Page 5 of 20

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Operating Temperature

DAC08AQ, DAC08Q

−55°C to +125°C

DAC08HQ, DAC08EQ, DAC08CQ,

DAC08HP, DAC08EP

0°C to +70°C

DAC08CP, DAC08CS

−40°C to +85°C

−65°C to +150°C

Storage Temperature Q Package

−65°C to +150°C

Storage Temperature P Package

−65°C to +125°C

Lead Temperature (Soldering, 60 sec)

300°C

V+ Supply to V− Supply

36 V

Logic Inputs

V− to V− + 36 V

V− to V+

4.25 mA

V− to V+

Reference Input Differential Voltage

±18 V

5.0 mA

Package Type

Unit

16-Lead CERDIP (Q)

100

16

°C/W

16-Lead PDIP (P)

82

39

°C/W

20-Terminal LCC (RC)

76

36

°C/W

16-Lead SOIC (S)

111

35

°C/W

1

device in socket for CERDIP, PDIP, and LCC packages;

device soldered to printed circuit board for SOIC package.

Stresses greater than those listed under Absolute Maximum

Ratings may cause permanent damage to the device. This is a

stress rating only and functional operation of the device at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on

the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.