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STM8AF5269 数据表(PDF) 87 Page - STMicroelectronics

部件名 STM8AF5269
功能描述  Automotive 8-bit MCU, with up to 128 Kbytes Flash, data EEPROM
PDF  110 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STM8AF5269 数据表(HTML) 87 Page - STMicroelectronics

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STM8AF52/62xx, STM8AF51/61xx
Electrical characteristics
Doc ID 14395 Rev 9
87/110
10.4
Thermal characteristics
In case the maximum chip junction temperature (TJmax) specified in Table 26: General
operating conditions is exceeded, the functionality of the device cannot be guaranteed.
TJmax, in degrees Celsius, may be calculated using the following equation:
Equation 3
TJmax = TAmax + (PDmax x ΘJA)
where:
TAmax is the maximum ambient temperature in ° C
ΘJA is the package junction-to-ambient thermal resistance in ° C/W
PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax)
PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/Omax represents the maximum power dissipation on output pins
where:
Equation 4
PI/Omax = Σ (VOL * IOL) + Σ((VDD - VOH) * IOH)
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low- and high-level in the
application.
10.4.1
Reference document
JESD51-2 integrated circuits thermal test method environment conditions - natural
convection (still air). Available from www.jedec.org.
Table 51.
Thermal characteristics(1)
1.
Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection
environment.
Symbol
Parameter
Value
Unit
ΘJA
Thermal resistance junction-ambient
LQFP 80 - 14 x 14 mm
38
°C/W
ΘJA
Thermal resistance junction-ambient
LQFP 64 - 10 x 10 mm
46
°C/W
ΘJA
Thermal resistance junction-ambient
LQFP 48 - 7 x 7 mm
57
°C/W
ΘJA
Thermal resistance junction-ambient
LQFP 32 - 7 x 7 mm
59
°C/W
ΘJA
Thermal resistance junction-ambient
VFQFPN 32 - 5 x 5 mm
25
°C/W



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