CPC9909

R03

www.ixysic.com

11

3.5 Mechanical Dimensions

3.5.1 8-Pin SOIC Package

3.5.2 8-Pin SOIC EP Package

Note: Thermal pad should be electrically connected to GND, pin 3.

Dimensions

mm

(inches)

PCB Land Pattern

Pin 1

Pin 8

3.937 ± 0.254

(0.155 ± 0.010)

5.994 ± 0.254

(0.236 ± 0.010)

0.406 ± 0.076

(0.016 ± 0.003)

4.928 ± 0.254

(0.194 ± 0.010)

1.270 REF

(0.050)

1.346 ± 0.076

(0.053 ± 0.003)

0.051 MIN - 0.254 MAX

(0.002 MIN - 0.010 MAX)

0.559 ± 0.254

(0.022 ± 0.010)

0.762 ± 0.254

(0.030 ± 0.010)

1.27

(0.050)

5.40

(0.213)

1.55

(0.061)

0.60

(0.024)

Recommended PCB Land Pattern

Dimensions

mm

(inches)

1.346 ± 0.076

(0.053 ± 0.003)

0.051 MIN - 0.254 MAX

(0.002 MIN - 0.010 MAX)

4.928 ± 0.254

(0.194 ± 0.010)

Pin 1

0.406 ± 0.076

(0.016 ± 0.003)

5.994 ± 0.254

(0.236 ± 0.010)

3.937 ± 0.254

(0.155 ± 0.010)

1.270 REF

(0.050)

0.762 ± 0.254

(0.030 ± 0.010)

7º

2.540 ± 0.254

(0.100 ± 0.010)

3.556 ± 0.254

(0.140 ±0.010)

1.27

(0.050)

5.40

(0.209)

1.55

(0.061)

0.60

(0.024)

2.75

(0.108)

3.80

(0.150)