STPS2L60

Characteristics

Doc ID 9173 Rev 6

5/9

Figure 13.

Junction capacitance versus

reverse voltage applied

(typical values)

Figure 14.

Forward voltage drop versus

forward current

(maximum values, low level)

C(pF)

10

100

1000

1

10

100

F=1MHz

V

=30mV

T =25°C

OSC

j

V (V)

R

I

(A)

FM

0

1

2

3

4

5

6

7

8

9

10

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

V

(V)

FM

T =25°C

(maximum values)

j

T =125°C

(maximum values)

j

T =125°C

(typical values)

j

Figure 15.

Thermal resistance junction to

ambient versus copper surface

under each lead (SMA and SMB flat)

Figure 16.

Thermal resistance versus lead

length (DO-41)

R

(°C/W)

th(j-a)

0

10

20

30

40

50

60

70

80

90

100

110

120

130

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

S(Cu)(cm²)

SMA

SMBflat

epoxy printed circuit board FR4, copper thickness: 35 µm

R (°C/W)

th

0

20

40

60

80

100

120

5

10152025

L

(mm)

leads