MPC8245EC datasheet(13/68 Pages) FREESCALE

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MPC8245 Integrated Processor Hardware Specifications, Rev. 10

Freescale Semiconductor

Electrical and Thermal Characteristics

4.4

Thermal Characteristics

Table 6 provides the package thermal characteristics for the MPC8245. For details, see Section 7.8,

“Thermal Management.”

4.5

AC Electrical Characteristics

After fabrication, functional parts are sorted by maximum processor core frequency as shown in Table 7

and tested for conformance to the AC specifications for that frequency. The processor core frequency is

determined by the bus (PCI_SYNC_IN) clock frequency and the settings of the PLL_CFG[0:4] signals.

Parts are sold by maximum processor core frequency. See Section 9, “Ordering Information,” for details

on ordering parts.

Table 6. Thermal Characteristics

Characteristic

Symbol

Value

Unit

Notes

Junction-to-ambient natural convection

(Single-layer board—1s)

RθJA

16.1

°C/W

1, 2

Junction-to-ambient natural convection

(Four-layer board—2s2p)

RθJMA

12.0

°C/W

1, 3

Junction-to-ambient (@200 ft/min)

(Single-layer board—1s)

RθJMA

11.6

°C/W

1, 3

Junction-to-ambient (@200 ft/min)

(Four layer board—2s2p)

RθJMA

9.0

°C/W

1, 3

Junction-to-board

RθJB

4.8

°C/W

Junction-to-case

RθJC

1.8

°C/W

Junction-to-package top (natural convection)

ΨJT

1.0

°C/W

Notes:

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal

resistance.

2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.

3. Per JEDEC JESD51-6 with the board horizontal.

4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1) with the cold plate used for case temperature.

6. Thermal characterization parameter indicating the temperature difference between the package top and the junction

temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written

as Psi-JT.

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