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ASTMB488 数据表(PDF) 17 Page - ITT Industries |
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ASTMB488 数据表(HTML) 17 Page - ITT Industries |
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17 / 41 page ![]() MIL-DTL-24308G w/AMENDMENT 2 17 TABLE XI. Qualification inspection. Inspection Requirement paragraph Test method paragraph Connector class 1/ 1 2 3 4 5 Group I Visual and mechanical inspection 3.1, 3.3, 3.4, 3.6, and 3.7 4.5.2 X X X X X Magnetic permeability (classes N and M) 2/ 3.5.1 4.5.3 X X Maintenance aging (crimp type) 3.5.2 4.5.4 X X Contact insertion and removal forces 3.5.3 4.5.5 X X Mating and unmating force 3.5.4 4.5.6 X X Contact retention 3/ 3.5.5 4.5.7 X X X X Dielectric withstanding voltage: 2/ At sea level 3.5.6 4.5.8.1 X X X X X At altitude 3.5.6 4.5.8.2 X X X X X Cable retention (flat cable only) 4/ 3.5.7 4.5.9 X Insulation resistance at ambient temperature 2/ 3.5.8 4.5.10 X X X X X Contact resistance 3.5.9 4.5.11 X X X Contact engagement and separation forces 3.5.10 4.5.12 X X X Mating and unmating force 3.5.4 4.5.6 X X X X X Temperature cycling (classes G, H, and N) 3.5.11 4.5.13 X X X X X Temperature cycling (classes D, K, and M) 3.5.11.1 4.5.13.1 X X X X X Air leakage (classes H and K) 3.5.12 4.5.14 X Humidity 3.5.13 4.5.15 X X X X X Dielectric withstanding voltage 3.5.6 4.5.8 X X X X X Insulation resistance 3.5.8 4.5.10 X X X X X Vibration 3.5.14 4.5.16 X X X X X Shock 3.5.15 4.5.17 X X X X X Durability 3.5.16 4.5.18 X X X X X Contact engagement and separation forces 3.5.10 4.5.12 X X X Mating and unmating force 3.5.4 4.5.6 X X X X X Salt spray (corrosion) 3/ 3.5.17 4.5.19 X X X X X Contact resistance 3.5.9 4.5.11 X X X Mating and unmating 3.5.4 4.5.6 X X X X X Contact retention 3.5.5 4.5.7 X X X X Oversize pin exclusion 3.5.18 4.5.20 X X Contact resistance 3.5.9 4.5.11 X X Resistance to test probe damage 3.5.19 4.5.21 X X Contact engagement and separation forces 3.5.10 4.5.12 X X Fluid immersion 2/ 3.5.20 4.5.22 X X X X X Mating and unmating force 2/ 3.5.4 4.5.6 X X X X X Insert retention 3.5.21 4.5.23 X X X X X Visual and mechanical inspection 3.1, 3.3, 3.4, 3.6 and 3.7 4.5.2 X X X X X Thermal vacuum outgassing (classes D, K, and M) 5/ 3.5.24 4.5.26 X X X X X Group II 6/, 7/ Resistance to solder heat 3.5.25 4.5.27 X X X Group III Solderability 6/ 3.5.23 4.5.24 X X X Contact pin strength 3.5.22 4.5.25 X X X See footnotes on next page. |
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