ESDAXLC6-1MY2

Recommendation on PCB assembly

Doc ID 16923 Rev 2

7/11

4

Recommendation on PCB assembly

4.1

Stencil opening design

1.

General recommendation on stencil opening design

a)

Stencil opening dimensions: L (Length), W (Width), T (Thickness).

Figure 13.

Stencil opening dimensions

b)

General design rule

Stencil thickness (T) = 75 ~ 125 µm

2.

Reference design

a)

Stencil opening thickness: 100 µm

b)

Stencil opening for central exposed pad: Opening to footprint ratio is 50%.

c)

Stencil opening for leads: Opening to footprint ratio is 90%.

Figure 14.

Recommended stencil window position

L

T

W

Aspect Ratio

W

T

-----

1.5

≥

=

Aspect Area

LW

×

2T L

W

+

()

----------------------------

0.66

≥

=

Lead footprint on PCB

Stencil window

position

Lead footprint on PCB

Package footprint

0.45 mm

0.39 mm

0.05 mm

0.05 mm

Stencil window

position