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ESDAXLC6-1MY2 数据表(PDF) 5 Page - STMicroelectronics |
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ESDAXLC6-1MY2 数据表(HTML) 5 Page - STMicroelectronics |
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5 / 11 page ![]() ESDAXLC6-1MY2 Package information Doc ID 16923 Rev 2 5/11 3 Package information ● Epoxy meets UL 94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Note: Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Table 3. µQFN-2L dimensions Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.45 0.50 0.55 0.017 0.020 0.022 A1 0.00 0.05 0.000 0.002 b1 0.20 0.25 0.30 0.008 0.010 0.012 b2 0.20 0.25 0.30 0.008 0.010 0.012 D 1.00 0.039 E 0.60 0.024 e 0.65 0.026 L1 0.45 0.50 0.55 0.018 0.020 0.022 L2 0.45 0.50 0.55 0.018 0.020 0.022 Figure 10. Footprint (dimensions in mm) Figure 11. Marking INDEX AREA (D/2 x E/2) INDEX AREA (D/2 x E/2) OPTIONAL PIN # 1 ID D E A1 A b1 e b2 L2 L1 0.55 0.40 0.50 0.55 Pin1 Pin 2 7 |
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