Function description and application information

SPMD150STP

20/23

Doc ID 17160 Rev 1

An internal100 k

Ω resistor plus a 100 nF capacitor connected to the EN pin, seta 400 µs off

time, before recovering normal operation (see Figure 9 and Figure 21).

Figure 21.

Overcurrent protection waveforms

4.7

Thermal characteristics

The case-to-ambient thermal resistance is 8 °C/W. This produces a 40 °C temperature

increase of the module surface for 5 W of internal dissipation.

According to ambient temperature and/or to maximum case operating temperature (85 °C),

an additional heat sink or forced ventilation may be required.

4.8

Case grounding

The module case is internally connected to GND1 (pin13) and GND2 (pin14). To obtain

additional effective EMI shield, the PCB area below the module can be used as an effective

sixth side shield.