AD8133

Rev. 0 | Page 16 of 16

OUTLINE DIMENSIONS

1

24

6

7

13

19

18

BOTTOM

VIEW

12

2.25

2.10 SQ

1.95

0.60 MAX

0.50

0.40

0.30

0.30

0.23

0.18

2.50 REF

0.50

BSC

12° MAX

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

1.00

0.85

0.80

SEATING

PLANE

PIN 1

INDICATOR

TOP

VIEW

3.75

BSC SQ

4.00

BSC SQ

PIN 1

INDICATOR

0.60 MAX

COPLANARITY

0.08

0.20 REF

0.25 MIN

COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-2

Figure 37. 24-Lead Lead Frame Chip Scale Package [LFCSP],

4 mm× 4 mm (CP-24)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Package

Package Description

Package Outline

AD8133ACP-REEL

−40°C to +85°C

24-Lead LFCSP

CP-24

AD8133ACP-REEL7

−40°C to +85°C

24-Lead LFCSP

CP-24

AD8133ACPZ-REEL1

−40°C to +85°C

24-Lead LFCSP

CP-24

AD8133ACPZ-REEL71

−40°C to +85°C

24-Lead LFCSP

CP-24

© 2004 Analog Devices, Inc. All rights reserved. Trademarks and regis-

tered trademarks are the property of their respective owners.

D04769–0–7/04(0)