Data Sheet

ADG904/ADG904-R

Rev. C | Page 13 of 16

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-153-AC

20

1

11

10

6.40 BSC

4.50

4.40

4.30

PIN 1

6.60

6.50

6.40

SEATING

PLANE

0.15

0.05

0.30

0.19

0.65

BSC

1.20 MAX

0.20

0.09

0.75

0.60

0.45

8°

0°

COPLANARITY

0.10

Figure 31. 20-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-20)

Dimensions shown in millimeters

0.50

BSC

0.65

0.60

0.55

0.30

0.25

0.18

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGD-1.

BOTTOM VIEW

TOP VIEW

EXPOSED

PAD

PIN 1

INDICATOR

4.10

4.00 SQ

3.90

SEATING

PLANE

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.20 REF

0.20 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

2.30

2.10 SQ

2.00

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

1

20

6

10

11

15

16

5

Figure 32. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

4 mm × 4 mm Body, Very Very Thin Quad

(CP-20-6)

Dimensions shown in millimeters