Data Sheet

ADP2300/ADP2301

Rev. C | Page 23 of 28

CIRCUIT BOARD LAYOUT RECOMMENDATIONS

Good circuit board layout is essential to obtain the best

performance from the ADP2300/ADP2301. Poor layout can

affect the regulation and stability, as well as the electromagnetic

interface (EMI) and electromagnetic compatibility (EMC)

performance. A PCB layout example is shown in Figure 50.

Refer to the following guidelines for a good PCB layout:

•

Place the input capacitor, inductor, catch diode, output

capacitor, and bootstrap capacitor close to the IC using

short traces.

•

Ensure that the high current loop traces are as short and wide

as possible. The high current path is shown in Figure 49.

•

Maximize the size of ground metal on the component side

to improve thermal dissipation.

•

Use a ground plane with several vias connecting to the

component side ground to further reduce noise inter-

ference on sensitive circuit nodes.

•

Minimize the length of the FB trace connecting the top of the

feedback resistive voltage divider to the output. In addition,

keep these traces away from the high current traces and the

switch node to avoid noise pickup.

VIN

BST

SW

FB

EN

GND

ADP2300/

ADP2301

Figure 49. Typical Application Circuit with High Current Traces Shown in Blue

INDUC TOR

L1

C1

C 2

C 3

IN PU T CA P

B ST CA P

D 1

CA TCH D IOD E

ADP2300/ADP2301

Figure 50. Recommended PCB Layout for the ADP2300/ADP2301