ADL5592

Rev. 0 | Page 19 of

20

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-WJJD-2

1

0.50

BSC

TOP VIEW

BOTTOM VIEW

INDEX

AREA

6.00

BSC SQ

40

11

20

21

30

31

10

EXPOSED

PAD

PIN 1

INDICATOR

4.25

4.15 SQ

4.00

0.50

0.40

0.30

0.20 MIN

SEATING

PLANE

0.80

0.75

0.70

0.30

0.25

0.18

0.05 MAX

0.02 NOM

0.20 REF

THE EXPOSED METAL PADDLE ON THE

BOTTOM OF THE LFCSP PACKAGE

MUST BE SOLDERED TO PCB GROUND

FOR PROPER HEAT DISSIPATION AND

ALSO FOR NOISE AND MECHANICAL

STRENGTH BENEFITS.

Figure 27. 40-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

6 mm × 6 mm Body, Very Very Thin Quad

(CP-40-2)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Ordering Quantity

ADL5592ACPZ-R71

−40°C to +85°C

40-Lead LFCSP_WQ, 7" Tape and Reel

CP-40-2

3,000

ADL5592-EVALZ1

Evaluation Board