USB2513 datasheet(54/63 Pages) MICROCHIP

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USB 2.0 Hi-Speed Hub Controller

Datasheet

Revision 2.2 (02-17-12)

SMSC USB251xB/xBi

DATASHEET

6.2.1

Package Thermal Specifications

Thermal parameters are measured or estimated for devices with the exposed pad soldered to thermal

vias in a multilayer 2S2P PCB per JESD51. Thermal resistance is measured from the die to the

ambient air. The values provided are based on the package body, die size, maximum power

consumption, 85°C ambient temperature, and 125°C junction temperature of the die.

Table 6.9 Package Thermal Resistance Parameters

Use the following formulas to calculate the junction temperature:

TJ = P x ΘJA + TA

TJ = P x ΨJT + TT

SYMBOL

USB2512B/12Bi

USB2513B/13Bi

USB2514B/14Bi

(

°C/W)

VELOCITY

(meters/s)

ΘJA

40.1

35.0

ΨJT

0.5

0.7

ΘJC

6.3

Table 6.10 Package Thermal Resistance Parameters

SYMBOL

USB2512B/12Bi USB2513B/13Bi

USB2514B/14Bi

(

°C/W)

VELOCITY (meters/s)

ΘJA

40.1

35.0

ΨJT

0.5

0.7

ΘJC

6.3

USB2513 数据表(PDF) 54 Page - Microchip Technology

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