M95160-R datasheet(44/47 Pages) STMICROELECTRONICS

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Package mechanical data

M95160 M95160-W M95160-R M95160-DF

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DocID022580 Rev 4

Figure 26. WLCSP-R–1.350 x 1.365 mm 0.4 mm pitch 8 bumps, package outline

1. Primary datum Z and seating plane are defined by the spherical crowns of the bump.

2. Drawing is not to scale.

3. Preliminary data.

Table 24. WLCSP-R – 1.350 x 1.365 mm 0.4 mm pitch 8 bumps, package mechanical

data (preliminary data)

Symbol

millimeters

inches(1)

1. Values in inches are converted from mm and rounded to four decimal digits.

Typ

Min

Max

Typ

Min

Max

0.545

0.490

0.600

0.0193

0.0215

0.0236

0.190

0.0075

0.355

0.014

b(2)

2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

0.270

0.240

0.300

0.0106

0.0094

0.0118

1.350

1.475

0.0531

0.0581

1.365

1.490

0.0537

0.0587

0.400

0.0157

0.800

0.0315

0.282

0.0111

0.275

0.0108

N (total number of

terminals)

aaa

0.110

0.0043

eee

0.060

0.0024

(4X)

aaa

WAFER BACK SIDE

SIDE VIEW

bbb

Detail A

BUMP SIDE

Pin 1 corner

DETAIL A

ROTATED 90 °

BUMP

eee

Øccc M

Øddd M

ZX Y

Øb

Seating plane

1C_ME

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