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ADL5372ACPZ-R21 数据表(PDF) 12 Page - Analog Devices |
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ADL5372ACPZ-R21 数据表(HTML) 12 Page - Analog Devices |
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12 / 24 page ![]() ADL5372 Rev. 0 | Page 12 of 24 BASIC CONNECTIONS Figure 25 shows the basic connections for the ADL5372. VPS5 VPS3 VPS4 VPS2 VPS2 VOUT COM1 VPS1 COM1 VPS1 VPS1 VPS1 1 2 3 4 5 6 18 17 16 15 14 13 VOUT C13 0.1µF C11 OPEN C12 0.1µF CLON 100pF C14 0.1µF C15 0.1µF C16 0.1µF COUT 100pF VPOS QBBP QBBN IBBN IBBP EXPOSED PADDLE CLOP 100pF LO GND Z1 F-MOD Figure 25. Basic Connections for the ADL5372 Power Supply and Grounding All the VPS pins must be connected to the same 5 V source. Adjacent pins of the same name can be tied together and decoupled with a 0.1 μF capacitor. These capacitors should be located as close as possible to the device. The power supply can range between 4.75 V and 5.25 V. The COM1 pin, COM2 pin, COM3 pin, and COM4 pin should be tied to the same ground plane through low impedance paths. The exposed paddle on the underside of the package should also be soldered to a low thermal and electrical impedance ground plane. If the ground plane spans multiple layers on the circuit board, they should be stitched together with nine vias under the exposed paddle. The Application Note AN-772 discusses the thermal and electrical grounding of the LFCSP in detail. Baseband Inputs The baseband inputs QBBP, QBBN, IBBP, and IBBN must be driven from a differential source. The nominal drive level of 1.4 V p-p differential (700 mV p-p on each pin) should be biased to a common-mode level of 500 mV dc. The dc common-mode bias level for the baseband inputs may range from 400 mV to 600 mV. This results in a reduction in the usable input ac swing range. The nominal dc bias of 500 mV allows for the largest ac swing, limited on the bottom end by the ADL5372 input range and on the top end by the output compliance range on most DACs from Analog Devices. LO Input A single-ended LO signal should be applied to the LOIP pin through an ac coupling capacitor. The recommended LO drive power is 0 dBm. The LO return pin, LOIN, should be ac-coupled to ground through a low impedance path. The nominal LO drive of 0 dBm can be increased to up to 6 dBm to realize an improvement in the noise performance of the modulator. This improvement is tempered by degradation in the sideband suppression performance (see Figure 20) and, therefore, should be used judiciously. If the LO source cannot provide the 0 dBm level, then operation at a reduced power below 0 dBm is acceptable. Reduced LO drive results in slightly increased modulator noise. The effect of LO power on sideband suppression and carrier feedthrough is shown in Figure 20. The effect of LO power on GSM noise is shown in Figure 35. RF Output The RF output is available at the VOUT pin (Pin 13). The VOUT pin connects to an internal balun, which is capable of driving a 50 Ω load. For applications requiring 50 Ω output impedance, external matching is needed (see Figure 8 for S22 performance). The internal balun provides a low dc path to ground. In most situations, the VOUT pin should be ac-coupled to the load. |
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