ADA4895-2ARMZ-R7 datasheet(9/24 Pages) AD

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Data Sheet

ADA4895-2

Rev. 0 | Page 9 of 24

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

Supply Voltage

11 V

Power Dissipation

See Figure 3

Common-Mode Input Voltage

−V

S − 0.7 V to +VS + 0.7 V

Differential Input Voltage

±0.7 V

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +125°C

Lead Temperature (Soldering 10 sec)

300°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, θJA is

specified for a device soldered in a circuit board for surface-

mount packages. Table 6 lists the θJA for the ADA4895-2.

Table 6. Thermal Resistance

Package Type

Unit

10-Lead Dual MSOP

210

°C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation for the ADA4895-2 is

limited by the associated rise in junction temperature (TJ) on

the die. At approximately 150°C, which is the glass transition

temperature, the properties of the plastic change. Even tempo-

rarily exceeding this temperature limit can change the stresses

that the package exerts on the die, permanently shifting the

parametric performance of the ADA4895-2. Exceeding a junction

temperature of 175°C for an extended period of time can result

in changes in silicon devices, potentially causing degradation or

loss of functionality.

The power dissipated in the package (PD) is the sum of the

quiescent power dissipation and the power dissipated in the

die due to the ADA4895-2 drive at the output.

PD = Quiescent Power + (Total Drive Power − Load Power)

The quiescent power dissipation is the voltage between the supply

pins (±VS) multiplied by the quiescent current (IS).

(

)

OUT

−













RMS output voltages should be considered. If RL is referenced

to −VS, as in single-supply operation, the total drive power is

VS × IOUT. In single-supply operation with RL referenced to −VS,

the worst case is VOUT = VS/2.

If the rms signal levels are indeterminate, consider the worst case,

when VOUT = VS/4 with RL referenced to midsupply.

(

) ( )

Airflow increases heat dissipation, effectively reducing θJA. Also,

more metal directly in contact with the package leads reduces θJA.

Figure 3 shows the maximum safe power dissipation in the

package vs. the ambient temperature on a JEDEC standard,

4-layer board. θJA values are approximations.

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

–40 –30 –20 –10

90 100 110 120

AMBIENT TEMPERATURE (°C)

TJ = 150°C

ADA4895-2

10-LEAD MSOP

Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

ESD CAUTION

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