ADN8831

Data Sheet

Rev. A | Page 18 of 20

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

32

9

16

17

24

25

8

EXPOSED

PAD

PIN 1

INDICATOR

3.25

3.10 SQ

2.95

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.50

0.40

0.30

0.25 MIN

Figure 22. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

5 mm× 5 mm Body, Very Thin Quad

(CP-32-7)

Dimensions Shown in Millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

ADN8831ACPZ-R2

−40

C to +85C

32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-32-7

ADN8831ACPZ-REEL7

−40

C to +85C

32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-32-7

ADN8831-EVALZ

−40

C to +85C

Evaluation Board