MP3360 datasheet(2/8 Pages) MPS

2 / 8 page

MP3360 – HIGHLY INTEGRATED PHOTO FLASH CHARGER AND IGBT DRIVER

MP3360 Rev. 0.9

www.MonolithicPower.com

1/29/2010

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

Package

Top Marking

Free Air Temperature (TA)

MP3360

10-pin, 2x2 Flip QFN

4KY

-40

°C to +85°C

For Tape & Reel, add suffix –Z (e.g. MP3360DG–Z);

For RoHS Compliant Packaging, add suffix –LF(e.g. MP3360DG–LF–Z)

PACKAGE REFERENCE

TOP VIEW

VIGBT

VIN

AGND

PGND

CHG

IGBTIN

IGBTOUT

RDYB

ABSOLUTE MAXIMUM RATINGS

(1)

VIN to GND .........................................-0.3Vto 6V

CHG, IGBTIN, IGBTOUT, VIGBT,

RDYB to AGND .................................-0.3Vto 6V

FB to AGND...................................-60V to 350V

SW to AGND...................................-0.3V to 60V

PGND to AGND ...........................-0.3V to +0.3V

2X2, 10 pin Flip Chip Thermal Resistance

Operating Temperature Ranges .........................

............................................. -20

°C to +85°C

Storage Temperature............... -55

°C to +150°C

Junction Temperature............................ +150

°C

Continuous Power Dissipation (TA = +25°C)

(2)

………………………………………………....1.6W

Lead Temperature (Solder).....................+260

°C

Recommended Operating Conditions

(3)

Supply Voltage VIN .............................2.5V to 6V

Operating Junct. Temp (TJ)...... -40°C to +125°C

Thermal Resistance

(4)

θJA

θJC

2x2 Flip Chip ...........................80 ...... 16 ...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its operating

conditions.

4) Measured on JESD51-7, 4-layer PCB.

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