MP8760GL datasheet(2/24 Pages) MPS

2 / 24 page

MP8760 — 6A, 18V, SYNCHRONOUS STEP-DOWN CONVERTER

MP8760 Rev. 1.1

www.MonolithicPower.com

11/4/2013

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

Package

Top Marking

MP8760GL*

13-Pin QFN(3×4mm)

MP8760

MP8760GLE**

16-Pin QFN(3×4mm)

MP8760E

* For Tape & Reel, add suffix –Z (e.g. MP8760GL–Z)

** For Tape & Reel, add suffix –Z (e.g. MP8760GLE–Z)

Note: The 16-pin QFN package is preferred and recommended for new designs

PACKAGE REFERENCE

TOP VIEW

PGND

BST

910

VCC

AGND

FREQ

PGND

TOP VIEW

13-Pin QFN (3x4mm)

16-Pin QFN (3x4mm)

ABSOLUTE MAXIMUM RATINGS (1)

Supply Voltage VIN ....................................... 21V

VSW....................................... −0.3V to VIN + 0.3V

VSW (30ns).................................. −3V to VIN + 3V

VBST ...................................................... VSW + 6V

Enable Current IEN

(2) ..................................................2.5mA

All Other Pins.................................–0.3V to +6V

Continuous Power Dissipation (TA=+25°)

(3)

QFN3×4 ..................................................... 2.7W

Junction Temperature...............................150°C

Lead Temperature ....................................260°C

Storage Temperature.............. −65°C to +150°C

Recommended Operating Conditions

(4)

Supply Voltage VIN ...........................4.5V to 18V

Output Voltage VOUT.....................0.611V to 13V

IEN .............................................................. 1mA

Operating Junction Temp. (TJ).−40°C to +125°C

Follow Layout Recommendation for Best

Performance

Thermal Resistance

(5)

θJA

θJC

QFN (3×4mm)......................... 46 ....... 9.... °C/W

Notes:

1) Exceeding these ratings may damage the device.

2) Refer to the section “Configuring the EN Control”.

3) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

4) The device is not guaranteed to function outside of its

operating conditions.

5) Measured on JESD51-7, 4-layer PCB.

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