TC1017 datasheet(14/22 Pages) MICROCHIP

部件名	TC1017

功能描述	150 mA, Tiny CMOS LDO With Shutdown

PDF	22 Pages

Scroll/Zoom	100%

制造商	MICROCHIP [Microchip Technology]

网页	http://www.microchip.com

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14 / 22 page

TC1017

DS21813D-page 14

FIGURE 5-3:

Power Dissipation vs.

Ambient Temperature (SOT-23 Package).

FIGURE 5-4:

Maximum Current vs.

Ambient Temperature (SOT-23 Package).

5.4

Layout Considerations

The primary path for heat conduction out of the SC-70/

SOT-23 package is through the package leads. Using

heavy wide traces at the pads of the device will facili-

tate the removal of the heat within the package, thus

lowering the thermal resistance R

θJA. By lowering the

thermal resistance, the maximum internal power dissi-

pation capability of the package is increased.

FIGURE 5-5:

SC-70 Package Suggested

Layout.

100

200

300

400

500

600

700

-40

-15

110

Ambient Temperature (°C)

100

120

140

160

-40

-15

110

Ambient Temperature (°C)

VIN - VOUT = 1V

SHDN

OUT

GND

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