NB669 datasheet(2/19 Pages) MPS

2 / 19 page

NB669, 24V, HIGH CURRENT SYNCHRONOUS BUCK CONVERTER WITH LDO

NB669 Rev. 1.01

www.MonolithicPower.com

7/23/2013

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

Package

Top Marking

NB669GQ

QFN16 (3mmx3mm)

AEV

For Tape & Reel, add suffix –Z (e.g. NB669GQ–Z)

PACKAGE REFERENCE

TOP VIEW

PGND

VIN

AGND

LDO

VCC

CLK

VOUT

ENLDO

BST

EXPOSED PAD

ON BACKSIDE

ABSOLUTE MAXIMUM RATINGS

(1)

Supply Voltage VIN ....................................... 24V

VSW........................................-0.3V to VIN + 0.3V

VSW (30ns)...................................-3V to VIN + 4V

VSW (5ns).......................................-6V to VIN+4V

VBST ................................................... VSW + 5.5V

VEN ............................................................... 12V

Enable Current IEN

(2)................................ 2.5mA

All Other Pins...............................-0.3V to +5.5V

Continuous Power Dissipation (TA=+25°C)

(3)

QFN16……………………..….…..…………1.8W

Junction Temperature...............................150

°C

Lead Temperature ....................................260

°C

Storage Temperature............... -65

°C to +150°C

Recommended Operating Conditions

(4)

Supply Voltage VIN........................... 6.5V to 22V

Output Voltage VOUT ...................................... 5V

Enable Current IEN...................................... 1mA

Operating Junction Temp. (TJ)..-40°C to +125°C

Thermal Resistance

(5)

θJA

θJC

QFN16 (3mmx3mm)............... 70 ...... 15...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) Refer to Page 11 of Configuring the EN Control.

3) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

4) The device is not guaranteed to function outside of its

operating conditions.

5) Measured on JESD51-7, 4-layer PCB.

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