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STM8L151F3P6 数据表(PDF) 52 Page - STMicroelectronics |
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STM8L151F3P6 数据表(HTML) 52 Page - STMicroelectronics |
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52 / 112 page ![]() Electrical parameters STM8L151x2, STM8L151x3 52/112 Doc ID 018780 Rev 4 7.3 Operating conditions Subject to general operating conditions for VDD and TA. 7.3.1 General operating conditions Table 14. General operating conditions Symbol Parameter Conditions Min. Max. Unit fSYSCLK (1) System clock frequency 1.65 V ≤ VDD < 3.6 V 0 16 MHz VDD Standard operating voltage 1.65(2) 3.6 V VDDA Analog operating voltage ADC1 not used Must be at the same potential as VDD 1.65(2) 3.6 V ADC1 used 1.8 3.6 V PD (3) Power dissipation at TA= 85 °C for suffix 3 and suffix 6 devices LQFP48 288 mW UFQFPN32 288 UFQFPN28 250 UFQFPN20 196 TSSOP20 181 Power dissipation at TA= 125 °C for suffix 3 devices LQFP48 77 UFQFPN32 185 UFQFPN28 62 UFQFPN20 49 TSSOP20 45 TA Temperature range 1.65 V ≤ VDD < 3.6 V (6 suffix version) -40 85 °C 1.65 V ≤ VDD < 3.6 V (3 suffix version) -40 125 TJ Junction temperature range -40 °C ≤ TA < 85 °C (6 suffix version) -40 105(4) -40 °C ≤ TA < 125 °C (3 suffix version) -40 130(4) 1. fSYSCLK = fCPU 2. 1.8 V at power-up, 1.65 V at power-down if BOR is disabled 3. To calculate PDmax(TA), use the formula PDmax=(TJmax -TA)/ Θ JA with TJmax in this table and Θ JA in “Thermal characteristics” table. 4. TJ max is given by the test limit. Above this value, the product behavior is not guaranteed. |
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