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STM8L151F3P6 数据表(PDF) 103 Page - STMicroelectronics

部件名 STM8L151F3P6
功能描述  8-bit ultralow power MCU, up to 8 KB Flash, up to 256 B data EEPROM, RTC, timers, USART, I2C, SPI, ADC, comparators
PDF  112 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STM8L151F3P6 数据表(HTML) 103 Page - STMicroelectronics

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STM8L151x2, STM8L151x3
Package characteristics
Doc ID 018780 Rev 4
103/112
10.2.2
32-lead ultra thin fine pitch quad flat no-lead 5x5 mm package
(UFQFPN32)
Figure 43.
UFQFPN32 package outline
1.
Drawing is not to scale.
2.
All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3.
There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and
solder this back-side pad to PCB ground.
4.
Dimensions are in millimeters.
Seating plane
ddd
C
C
A3
A1
A
D
e
9
16
17
24
32
Pin # 1 ID
R = 0.30
8
E
L
L
D2
1
b
E2
A0B8_ME
Bottom view



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