Preliminary

APR6016 Data Sheet

Voice Recording & Playback Device

Page 17

Revision 1.0

Electrical Characteristics

The following tables list Absolute Maximum Ratings, Recom-

mended DC Characteristics, and recommended AC Charac-

teristics for the APR6016 device.

Absolute Maximum Ratings

Stresses greater than those listed in Table 4 may cause per-

manent damage to the device. These specifications repre-

sent a stress rating only. Operation of the device at these or

any other conditions above those specified in the recom-

mended DC Characteristics or recommended AC Character-

istics of this specification is not implied. Maximum conditions

for extended periods may affect reliability.

Table 4

Absolute Maximum Ratings.

ANAIN+

17

19

Non-Inverting Analog Input: This input is the non-inverting input for the analog

signal that the user wishes to record. When the device is used in a differential

input configuration this pin should receive a 16 mV peak to peak input coupled

through a 0.1 uF capacitor. When the device is used in a single ended input con-

figuration this pin should receive a 32 mV peak to peak input coupled through a

0.1 uF capacitor.

/BUSY

21

23

Busy Output: This active low output is low during either a record, playback,

DIG_WRITE, DIG_READ or fast forward operation. The pin is tri-stated other-

wise. This pin can be connected to an LED to indicate playback/record operation

to the user. This pin can also be connected to an external microcontroller as an

indication of the status of playback, record, forward, or digital operation.

VCCD

27

30, 31, 32

Digital Power Supply: This connection supplies power for all on-chip digital cir-

cuitry. This pin should be connected to the 3.0 V power plane through a via. This

pin should also be connected to a 0.1 uF bypass cap as close to the pin as possi-

ble.

VCCA

18

20, 21

Analog Power Supply: This connection supplies power for all on-chip analog

circuitry. This pin should be connected to the 3.0 V power plane through a via.

This pin should also be connected to a 0.1 uF bypass cap as close to the pin as

possible.

VSSA

12,23

12, 13, 14, 24,

25, 26

Analog Ground: These pins should be connected to the ground plane through a

via. The connection should be made as close to the pin as possible.

VSSD

4

5, 6

Digital Ground: This pin should be connected to the ground plane through a via.

The connection should be made as close to the pin as possible.

NC

5, 6, 7,

10, 19,

20, 22

1, 7, 8, 22

No Connect: These pins should not be connected to anything on the board. Con-

nection of these pins to any signal, GND or VCC may result in incorrect device

behavior or cause damage to the device.

Pin Name

Pin No.

28 pin

TSOP

Pin No.

28 pin

DIP

Pad No. (Die)

Reference Figure

18

Functionality

Item

Symbol

Condition

Min

Max

Unit

Power Supply voltage

-0.3

7.0

V

Input Voltage

Device VCC = 3.0 V

-0.3

5.5

V

Storage Temperature

-

-65

150

Temperature Under Bias

-

-65

125

Lead Temperature

<10s

300