ADA4841-1/ADA4841-2

Rev. E | Page 20 of 20

2.54

2.44

2.34

TOP VIEW

8

1

5

4

0.30

0.25

0.20

BOTTOM VIEW

PIN 1 INDEX

AREA

SEATING

PLANE

0.80

0.75

0.70

1.80

1.70

1.60

0.203 REF

0.05 MAX

0.02 NOM

0.50 BSC

EXPOSED

PAD

3.10

3.00 SQ

2.90

PIN 1

INDICATOR

(R 0.15)

FORPROPERCONNECTIONOF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION

OF THIS DATA SHEET.

COPLANARITY

0.08

0.50

0.40

0.30

COMPLIANT

Figure 55. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]

3 mm × 3 mm Body, Very Very Thin, Dual Lead

(CP-8-11)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

Ordering Quantity

Branding

ADA4841-1YRZ

−40°C to +125°C

8-Lead SOIC_N

R-8

1

ADA4841-1YRZ-R7

−40°C to +125°C

8-Lead SOIC_N

R-8

1,000

ADA4841-1YRZ-RL

−40°C to +125°C

8-Lead SOIC_N

R-8

2,500

ADA4841-1YRJZ-R2

−40°C to +125°C

6-Lead SOT-23

RJ-6

250

HQB

ADA4841-1YRJZ-R7

−40°C to +125°C

6-Lead SOT-23

RJ-6

3,000

HQB

ADA4841-1YRJZ-RL

−40°C to +125°C

6-Lead SOT-23

RJ-6

10,000

HQB

ADA4841-2YRMZ

−40°C to +125°C

8-Lead MSOP

RM-8

1

HRB

ADA4841-2YRMZ-R7

−40°C to +125°C

8-Lead MSOP

RM-8

1,000

HRB

ADA4841-2YRMZ-RL

−40°C to +125°C

8-Lead MSOP

RM-8

3,000

HRB

ADA4841-2YRZ

−40°C to +125°C

8-Lead SOIC_N

R-8

1

ADA4841-2YRZ-R7

−40°C to +125°C

8-Lead SOIC_N

R-8

1,000

ADA4841-2YRZ-RL

−40°C to +125°C

8-Lead SOIC_N

R-8

2,500

ADA4841-2YCPZ-R2

−40°C to +125°C

8-Lead LFCSP_WD

CP-8-11

250

HRB

ADA4841-2YCPZ-R7

−40°C to +125°C

8-Lead LFCSP_WD

CP-8-11

1,500

HRB

ADA4841-2YCPZ-RL

−40°C to +125°C

8-Lead LFCSP_WD

CP-8-11

5,000

HRB

ADA4841-1YR-EBZ

−40°C to +125°C

Evaluation Board

ADA4841-1YRJ-EBZ

−40°C to +125°C

Evaluation Board

ADA4841-2YRM-EBZ

−40°C to +125°C

Evaluation Board

ADA4841-2YR-EBZ

−40°C to +125°C

Evaluation Board

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registered trademarks are the property of their respective owners.

D05614–0–12/10(E)