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AS1334

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Notes

Electrical Parameters

VDD, PVIN to SGND

-0.3

+7.0

V

PGND to SGND

-0.3

+0.3

V

POK, EN, FB

SGND - 0.3

VDD + 0.3

V

7.0V max

SW

PGND - 0.3

PVIN + 0.3

V

PVIN to VDD

-0.3

+0.3

V

Input Voltage Range

2.7

5.5

V

Recommended Load Current

650

mA

-40

+85

ºC

In applications where high power dissipation and/

or poor package thermal resistance is present,

the maximum ambient temperature may have to

be derated.

dependent on the maximum operating junction

power dissipation

junction-to ambient thermal resistance of the

part/package in the application (

the following

Electrostatic Discharge

Human Body Model

2

kV

Norm: MIL 883 E method 3015

Temperature Ranges and Storage Conditions

+150

ºC

Storage Temperature Range

-55

+150

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with IPC/

JEDEC J-STD-020“Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid State

Surface Mount Devices”.

The lead finish for Pb-free leaded packages is

matte tin (100% Sn).

Humidity

5

86

%

Non-condensing

Moisture Sensitive Level

1

Represents a max. floor life time of unlimited