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AS5215

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 6 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

Electrical Parameters

7

V

Input pin voltage (V_in)

-0.3

V

Input current (latchup immunity), I_scr

-100

100

mA

Norm: EIA/JESD78 Class II Level A

Electrostatic Discharge

Electrostatic discharge (ESD)

±2

kV

Norm: JESD22-A114E

Continous Power Dissipation

275

mW

Package thermal resistance (

Θ_JA)

27

ºC/W

Velocity =0; Multi Layer PCB; Jedec Standard Testboard

Temperature Ranges and Storage Conditions

Storage temperature (T_strg)

-65

150

ºC

Package body temperature (T_body)

260

ºC

Norm: IPC/JEDEC J-STD-020.

The reflow peak soldering temperature (body temperature)

specified is in accordance with IPC/JEDEC J-STD-020

“Moisture/Reflow Sensitivity Classification for Non-

Hermetic Solid State Surface Mount Devices”.

The lead finish for Pb-free leaded packages is matte tin

(100% Sn).

Humidity non-condensing

585

%

Moisture Sensitive Level (MSL)

3

Represents a maximum floor time of 168h