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Revision 1.12

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AS5311

Datasheet - A bs o lu t e M ax i m um R at in gs

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Electrical System Specifications on page 8 is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

DC supply voltage at pin VDD5V

-0.3

7

V

DC supply voltage at pin VDD3V3

5

V

Input pin voltage

-0.3

VDD5V

+0.3

V

Except VDD3V3

Input current (latchup immunity)

-100

100

mA

Norm: JEDEC 78

Electrostatic discharge

± 2

kV

Norm: MIL 883 E method 3015

Storage temperature

-55

125

°C

Min – 67°F; Max +257°F

Body temperature (Lead-free package)

260

°C

The reflow peak soldering temperature (body

temperature) specified is in accordance with IPC/

JEDEC J-STD-020C “Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid State Surface

Mount Devices”.

The lead finish for Pb-free leaded packages is matte tin

(100% Sn).

Humidity non-condensing

5

85

%

Moisture Sensitive Level (MSL)

3

Represents a maximum floor time of 168h