MCP23009ESS datasheet(47/50 Pages) MICROCHIP

47 / 50 page

DS22121B-page 47

MCP23009/MCP23S09

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office

Device

MCP23009:

8-Bit I/O Expander w/ I2C™ Interface

MCP23009T:

8-Bit I/O Expander w/ I2C Interface

(Tape and Reel)

MCP23S09:

8-Bit I/O Expander w/ SPI Interface

MCP23S09T:

8-Bit I/O Expander w/ SPI Interface

(Tape and Reel)

Temperature

Range

E= -40

°C to +125°C (Extended) *

Package

= Plastic Quad Flat, No Lead Package

(3x3x0.9 mm Body), 16-Lead

= Plastic DIP (300 mil Body), 18-Lead

= Plastic SOIC (300 mil Body), 18-Lead

= Plastic SSOP (5.3 mm), 20-Lead

PART NO.

/XX

Package

Temperature

Range

Device

Examples:

MCP23009-E/P:

Extended Temp.,

18LD PDIP package.

MCP23009-E/SO:

Extended Temp.,

18LD SOIC package.

MCP23009T-E/SO: Tape and Reel,

Extended Temp.,

18LD SOIC package.

MCP23009-E/SS:

Extended Temp.,

20LD SSOP package.

MCP23009T-E/SS: Tape and Reel,

Extended Temp.,

20LD SSOP package.

MCP23009-E/MG: Extended Temp.,

16LD QFN package.

MCP23S09-E/P:

Extended Temp.,

18LD PDIP package.

MCP23S09-E/SO:

Extended Temp.,

18LD SOIC package.

MCP23S09T-E/SO: Tape and Reel,

Extended Temp.,

18LD SOIC package.

MCP23S09T-E/MG: Tape and Reel,

Extended Temp.,

16LD QFN package.

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