ADL5601

Data Sheet

Rev. A | Page 12 of 16

BASIC CONNECTIONS

The basic connections for operating the ADL5601 are shown in

Figure 16. Recommended components are listed in Table 5. The

input and output should be ac-coupled with appropriately sized

capacitors (the device characterization was performed with

0.1 μF capacitors). A 5 V dc bias is supplied to the amplifier

through the bias inductor connected to RFOUT (Pin 3). The

bias voltage should be decoupled using a 1 µF capacitor, a 1.2 nF

capacitor, and a 68 pF capacitor.

C6

1µF

C5

1.2nF

C4

68pF

VCC

RFOUT

RFIN

RFIN

GND

GND

RFOUT

1

2

3

GND

ADL5601

(2)

C2

0.1µF

L1

470nH

C1

0.1µF

Figure 16. Basic Connections

SOLDERING INFORMATION AND RECOMMENDED

PCB LAND PATTERN

Figure 17 shows the recommended land pattern for the ADL5601.

To minimize thermal impedance, the exposed paddle on the

package underside, along with Pin 2, should be soldered to a

ground plane. If multiple ground layers exist, they should be

stitched together using vias. For more information on land

pattern design and layout, refer to the AN-772 Application

Note, A Design and Manufacturing Guide for the Lead Frame

Chip Scale Package (LFCSP).

1.50mm

3.00mm

1.27mm

0.62mm

3.48mm

1.80mm

0.86mm

5.37mm

0.20mm

0.762mm

0.635mm

0.86mm

Figure 17. Recommended Land Pattern

Table 5. Recommended Components for Basic Connections

Frequency

C1

C2

L1

C4

C5

C6

50 MHz to 4000 MHz

0.1 µF

0.1 µF

470 nH (Coilcraft 0603LS-NX or equivalent)

68 pF

1.2 nF

1 µF