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CMPWR160SA 数据表(PDF) 2 Page - California Micro Devices Corp |
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CMPWR160SA 数据表(HTML) 2 Page - California Micro Devices Corp |
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2 / 10 page ![]() CALIFORNIA MICRO DEVICES ©2000 California Micro Devices Corp. All rights reserved. SmartOR™ is a trademark of California Micro Devices Corporation. 12/5/2000 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 2 CMPWR160 Operating Conditions Parameter Range Unit VCC 4.2 to 5.5 V Temperature (Ambient) 0 to 70 ˚C Load Current 0 to 500 mA CEXT 10 ± 10% µF Absolute Maximum Ratings Parameter Rating Unit ESD Protection (HBM) 2000 V VCC/VOUT Voltage 6.0, GND –0.5 V SD Logic Input Voltage VCC + 0.5, GND –0.5 V POR Logic Output Voltage VOUT + 0.5, GND –0.5 V Temperature: Storage –40 to 150 Operating Ambient 0 to 70 ˚C Operating Junction 0 to 125 Power Dissipation Note 1 Internally Limited Electrical Operating Characteristics (over operating conditions unless specified otherwise) Symbol Parameter Conditions MIN TYP MAX UNIT VOUT Regulator Output Voltage 0mA < ILOAD < 500mA 3.135 3.30 3.465 V ILIM Regulator Current Limit 550 mA IS/C Short-Circuit Current Limit 300 mA VR LOAD Load Regulation VCC = 5V, ILOAD = 5mA to 500mA 75 mV VR LINE Line Regulation VCC = 4.2V to 5.5V, ILOAD = 5mA 2 mV VDO Regulator Dropout Voltage MIN VCC – VOUT for ILOAD = 500mA 0.6 0.9 V IQ Quiescent Supply Current Regulator Enabled (No Load) 35 50 µA ISD Shutdown Supply Current Regulator Disabled 7 10 µA IRCC VCC Pin Reverse Leakage VOUT = 3.3V, VCC = 0V 1 10 µA VIH SD Shutdown High Detect VCC = 5V 3.0 V VIL SD Shutdown Low Detect VCC = 5V 1.0 V VPOR POR Detect Threshold 4.2V < VCC < 5.5V 2.8 2.9 3.0 V TPOR POR Pulse Duration 20 30 40 ms RPOR POR Output Impedance After POR Threshold Detected 0.2 0.5 2 k Ω Sinking to GND/Sourcing from VCC TDISABLE Shutdown Temperature 160 ˚C THYST Thermal Hysteresis 20 ˚C Note 1: The SOIC package used is thermally enhanced through the use of a fused integral leadframe. The power rating is based on a printed circuit board heat spreading capability equivalent to 2 square inches of copper connected to the GND pins. Typical multi-layer boards using power plane construction will provide this heat spreading ability without the need for additional dedicated copper area. (Please consult with factory for thermal evaluation assistance.) |
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