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CMPWR160SA 数据表(PDF) 2 Page - California Micro Devices Corp

部件名 CMPWR160SA
功能描述  USB peripheral Power Management
PDF  10 Pages
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制造商  CALMIRCO [California Micro Devices Corp]
网页  http://www.calmicro.com
标志 CALMIRCO - California Micro Devices Corp

CMPWR160SA 数据表(HTML) 2 Page - California Micro Devices Corp

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CALIFORNIA MICRO DEVICES
©2000 California Micro Devices Corp. All rights reserved. SmartOR™ is a trademark of California Micro Devices Corporation.
12/5/2000
215 Topaz Street, Milpitas, California 95035

Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
2
CMPWR160
Operating Conditions
Parameter
Range
Unit
VCC
4.2 to 5.5
V
Temperature (Ambient)
0 to 70
˚C
Load Current
0 to 500
mA
CEXT
10 ± 10%
µF
Absolute Maximum Ratings
Parameter
Rating
Unit
ESD Protection (HBM)
2000
V
VCC/VOUT Voltage
6.0, GND –0.5
V
SD Logic Input Voltage
VCC + 0.5, GND –0.5
V
POR Logic Output Voltage
VOUT + 0.5, GND –0.5
V
Temperature: Storage
–40 to 150
Operating Ambient
0 to 70
˚C
Operating Junction
0 to 125
Power Dissipation Note 1
Internally Limited
Electrical Operating Characteristics
(over operating conditions unless specified otherwise)
Symbol
Parameter
Conditions
MIN
TYP
MAX
UNIT
VOUT
Regulator Output Voltage
0mA < ILOAD < 500mA
3.135
3.30
3.465
V
ILIM
Regulator Current Limit
550
mA
IS/C
Short-Circuit Current Limit
300
mA
VR LOAD
Load Regulation
VCC = 5V, ILOAD = 5mA to 500mA
75
mV
VR LINE
Line Regulation
VCC = 4.2V to 5.5V, ILOAD = 5mA
2
mV
VDO
Regulator Dropout Voltage
MIN VCC – VOUT for ILOAD = 500mA
0.6
0.9
V
IQ
Quiescent Supply Current
Regulator Enabled (No Load)
35
50
µA
ISD
Shutdown Supply Current
Regulator Disabled
7
10
µA
IRCC
VCC Pin Reverse Leakage
VOUT = 3.3V, VCC = 0V
1
10
µA
VIH SD
Shutdown High Detect
VCC = 5V
3.0
V
VIL SD
Shutdown Low Detect
VCC = 5V
1.0
V
VPOR
POR Detect Threshold
4.2V < VCC < 5.5V
2.8
2.9
3.0
V
TPOR
POR Pulse Duration
20
30
40
ms
RPOR
POR Output Impedance
After POR Threshold Detected
0.2
0.5
2
k
Sinking to GND/Sourcing from VCC
TDISABLE
Shutdown Temperature
160
˚C
THYST
Thermal Hysteresis
20
˚C
Note 1: The SOIC package used is thermally enhanced through the use of a fused integral leadframe. The power rating is based on a printed
circuit board heat spreading capability equivalent to 2 square inches of copper connected to the GND pins. Typical multi-layer boards
using power plane construction will provide this heat spreading ability without the need for additional dedicated copper area. (Please
consult with factory for thermal evaluation assistance.)



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