16

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.

3

1. Shock Resistance

2. Solder Heat Resistance

3. Vibration Resistance

4. Humidity Resistance

8. Terminal Strength

5. Storage at High Temperature

6. Storage at Low Temperature

7. Temperature Cycling

before test

after test

(%)

0.1

0.05

fosc. 0

-0.05

-0.1

before test

after test

(%)

0.1

0.05

fosc. 0

-0.05

-0.1

before test

after test

(%)

0.1

0.05

fosc. 0

-0.05

-0.1

(%)

0.1

0.05

fosc. 0

-0.05

-0.1

100

1000

(time)

(%)

0.1

0.05

fosc. 0

-0.05

-0.1

100

1000

(time)

(%)

0.1

0.05

fosc. 0

-0.05

-0.1

100

1000

(time)

(%)

0.1

0.05

fosc. 0

-0.05

-0.1

25

50

100

(cycle)

before test

after test

(%)

0.1

0.05

fosc. 0

-0.05

-0.1

Fig. 3-2 General Changes of Oscillation Frequency in Each Reliability Test (CSTLS4M00G53–B0)

150

180

220

245

260

Gradual

Cooling

Peak

Pre-heating

(150 to 180°C)

Heating

(220°C min.)

60 to 120s

30 to 60s

Fig. 3-3 Reflow Soldering Profile for MHz Band Chip

■

Deviation after Reliability Test

Item

Type

Oscillation Frequency

Other

Every Series

(from initial value)

Meets the individual

specification of each

product.

∗ CSTCC Series : within±0.3%

P17E.pdf

2012.10.31