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LMV358IPW 数据表(PDF) 26 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor. Click here to check the latest version.
部件名 LMV358IPW
功能描述  Low-Voltage Rail-To-Rail Output Operational Amplifiers
PDF  45 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  NSC [National Semiconductor (TI)]
网页  http://www.national.com
标志 NSC - National Semiconductor (TI)

LMV358IPW 数据表(HTML) 26 Page - National Semiconductor (TI)

Back Button LMV358IPW Datasheet HTML 22Page - National Semiconductor (TI) LMV358IPW Datasheet HTML 23Page - National Semiconductor (TI) LMV358IPW Datasheet HTML 24Page - National Semiconductor (TI) LMV358IPW Datasheet HTML 25Page - National Semiconductor (TI) LMV358IPW Datasheet HTML 26Page - National Semiconductor (TI) LMV358IPW Datasheet HTML 27Page - National Semiconductor (TI) LMV358IPW Datasheet HTML 28Page - National Semiconductor (TI) LMV358IPW Datasheet HTML 29Page - National Semiconductor (TI) LMV358IPW Datasheet HTML 30Page - National Semiconductor (TI) Next Button
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Device
Package
Type
Package
Drawing
Pins
SPQ
Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
LMV358IDR
SOIC
D
8
2500
330.0
12.8
6.4
5.2
2.1
8.0
12.0
Q1
LMV358IDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LMV358IDRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LMV358IPWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LMV358QDDUR
VSSOP
DDU
8
3000
180.0
8.4
2.25
3.35
1.05
4.0
8.0
Q3
LMV358QDGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LMV358QDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LMV321IDBVR
SOT-23
DBV
5
3000
180.0
180.0
18.0
LMV321IDBVR
SOT-23
DBV
5
3000
205.0
200.0
33.0
LMV321IDBVT
SOT-23
DBV
5
250
205.0
200.0
33.0
LMV321IDBVT
SOT-23
DBV
5
250
180.0
180.0
18.0
LMV321IDCKR
SC70
DCK
5
3000
180.0
180.0
18.0
LMV321IDCKR
SC70
DCK
5
3000
205.0
200.0
33.0
LMV321IDCKT
SC70
DCK
5
250
180.0
180.0
18.0
LMV321IDCKT
SC70
DCK
5
250
205.0
200.0
33.0
LMV324IDR
SOIC
D
14
2500
333.2
345.9
28.6
LMV324IDR
SOIC
D
14
2500
364.0
364.0
27.0
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Mar-2014
Pack Materials-Page 2



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