BAS70AS3 datasheet(5/6 Pages) CYSTEKEC

5 / 6 page

CYStech Electronics Corp.

Spec. No. : C248S3

Issued Date : 2012.07.09

Revised Date :

Page No. : 5/6

BAS70S3/BAS70AS3/BAS70CS3/BAS70SS3

CYStek Product Specification

Recommended wave soldering condition

Soldering Time

Product

Peak Temperature

Pb-free devices

5 +1/-1 seconds

260 +0/-5

°C

Recommended temperature profile for IR reflow

Pb-free Assembly

Profile feature

Sn-Pb eutectic Assembly

Average ramp-up rate

°C/second max.

(Tsmax to Tp)

Preheat

100

°C

150

°C

−Temperature Min(TS min)

−Temperature Max(TS max)

150

°C

200

°C

−Time(ts min to ts max)

60-120 seconds

60-180 seconds

Time maintained above:

−Temperature (TL)

183

°C

217

°C

− Time (tL)

60-150 seconds

Peak Temperature(TP)

240 +0/-5

°C

260 +0/-5

°C

Time within 5

°C of actual peak

10-30 seconds

20-40 seconds

temperature(tp)

Ramp down rate

°C/second max.

6 minutes max.

8 minutes max.

Time 25

°C to peak temperature

Note : All temperatures refer to topside of the package, measured on the package body surface.

BAS70AS3 数据表(PDF) 5 Page - Cystech Electonics Corp.

BAS70AS3 数据表(HTML) 5 Page - Cystech Electonics Corp.

Html Pages

1 2 3 4 5 6

数据表下载