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数据搜索系统，热门电子元器件搜索 |
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数据搜索系统，热门电子元器件搜索 |
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2SC2148 数据表(PDF) 2 Page - NEC |
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2SC2148 数据表(HTML) 2 Page - NEC |
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2 / 8 page  2SC2148, 2SC2149 2 2SC2148 2SC2149 TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE 600 400 200 0 50 100 110 140 150 200 TA −Ambient Temperature−°C free-air; Rth(j-a) 600 °C/W with infinite heat sink; Rth(j-c) 120 °C/W mounting on ceramic boad with solder (Al2O3 20 × 50 × 0.635 mm) ; Rth(j-a) 180 °C/W TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE 500 400 300 200 100 0 50 48 100 TA −Ambient Temperature−°C 150 200 free-air; Rth(j-a) 610 °C/W with infinite heat sink; Rth(j-c) 130 °C/W mounting on ceramic boad with solder (Al2O3 20 × 50 × 0.635 mm) ; Rth(j-a) 190 °C/W |
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