STM32L151C6 datasheet(52/131 Pages) STMICROELECTRONICS

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Electrical characteristics

STM32L151x6/8/B, STM32L152x6/8/B

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DocID17659 Rev 9

6.3

Operating conditions

6.3.1

General operating conditions

Table 12. Thermal characteristics

Symbol

Ratings

Value

Unit

TSTG

Storage temperature range

–65 to +150

°C

Maximum junction temperature

150

°C

Table 13. General operating conditions

Symbol

Parameter

Conditions

Min

Max

Unit

fHCLK

Internal AHB clock frequency

MHz

fPCLK1

Internal APB1 clock frequency

fPCLK2

Internal APB2 clock frequency

VDD

Standard operating voltage

BOR detector disabled

1.65

3.6

BOR detector enabled,

at power on

1.8

3.6

BOR detector disabled, after

power on

1.65

3.6

VDDA(1)

Analog operating voltage

(ADC and DAC not used)

Must be the same voltage as

VDD(2)

1.65

3.6

Analog operating voltage

(ADC or DAC used)

1.8

3.6

VIN

Input voltage on FT pins(3)

Input voltage on BOOT0 pin

Input voltage on any other pin

2.0 V ≤VDD ≤ 3.6 V

1.65 V ≤ VDD ≤ 2.0 V

–0.3

5.5

5.25

5.5

VDD+0.3

Power dissipation at

TA = 85 °C(4)

BGA100 package

339

Temperature range

Maximum power dissipation

–40

°C

Low power dissipation(5)

–40

105

Junction temperature range

-40 °C

≤ TA ≤ 105°C

–40

105

°C

1. When the ADC is used, refer to Table 54: ADC characteristics.

2. It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV between VDD and

VDDA can be tolerated during power-up and operation.

3. To sustain a voltage higher than VDD+0.3 V, the internal pull-up/pull-down resistors must be disabled.

4. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJ max (see Table 12: Thermal characteristics

on page 52).

5. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJ max (see Table 12:

Thermal characteristics on page 52).

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