Document Number: 91362

www.vishay.com

Revision: 15-Sep-08

1

Package Information

Vishay Siliconix

TO-251AA (HIGH VOLTAGE)

Notes

1. Dimensioning and tolerancing per ASME Y14.5M-1994.

2. Dimension are shown in inches and millimeters.

3. Dimension D and E do not include mold flash. Mold flash shall not exceed 0.13 mm (0.005") per side. These dimensions are measured at the

outermost extremes of the plastic body.

4. Thermal pad contour optional with dimensions b4, L2, E1 and D1.

5. Lead dimension uncontrolled in L3.

6. Dimension b1, b3 and c1 apply to base metal only.

7. Outline conforms to JEDEC outline TO-251AA.

Base

metal

Plating

b1, b3

(b, b2)

c1

(c)

Section B - B and C - C

A

c2

c

Lead tip

5

5

(Datum A)

Thermal PAD

E1

4

D1

View A - A

A1

A

A

C

Seating

plane

C

C

B

B

θ1

θ2

B

4

4

4

3

5

L1

L

L3

3 x b2

3 x b

3

b4

E

2 x e

0.010

C

B

M

A

0.25

0.010

B

A

0.25

L2

A

C

M

MILLIMETERS

INCHES

MILLIMETERS

INCHES

DIM.

MIN.

MAX.

MIN.

MAX.

DIM.

MIN.

MAX.

MIN.

MAX.

A

2.18

2.39

0.086

0.094

D1

5.21

-

0.205

-

A1

0.89

1.14

0.035

0.045

E

6.35

6.73

0.250

0.265

b

0.64

0.89

0.025

0.035

E1

4.32

-

0.170

-

b1

0.65

0.79

0.026

0.031

e

2.29 BSC

2.29 BSC

b2

0.76

1.14

0.030

0.045

L

8.89

9.65

0.350

0.380

b3

0.76

1.04

0.030

0.041

L1

1.91

2.29

0.075

0.090

b4

4.95

5.46

0.195

0.215

L2

0.89

1.27

0.035

0.050

c

0.46

0.61

0.018

0.024

L3

1.14

1.52

0.045

0.060

c1

0.41

0.56

0.016

0.022

θ1

0'

15'

0'

15'

c2

0.46

0.86

0.018

0.034

θ2

25'

35'

25'

35'

D

5.97

6.22

0.235

0.245

ECN: S-82111-Rev. A, 15-Sep-08

DWG: 5968