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• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

4

GaAs SPDT Switch

DC - 3.0 GHz

Rev. V4

MASW2000

ADVANCED:

Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY:

Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Handling Procedures

Permanent damage to the MASW2000 may occur if

the following precautions are not adhered to:

A. Cleanliness - The MASW2000 should be han-

dled in a clean environment. DO NOT attempt

to clean assembly after the MASW2000 is in-

stalled.

B. Static Sensitivity - All die handling equipment

and personnel should be DC grounded.

C. Transients - Avoid instrument and power supply

transients while bias is connected to the

MASW2000. Use shielded signal and bias ca-

bles to minimize inductive pick-up.

D. Bias - Apply voltage to either control port A1/B2

or A2/B1 only when the other is grounded. Nei-

ther port should be allowed to “float”.

E. General Handling - It is recommended that the

MASW2000 chip be handled along the long

side of the die with a sharp pair of bend tweez-

ers. DO NOT touch the surface of the chip with

fingers or tweezers.

Mounting

The MASW2000 is back-metallized with Pd/Ni/Au

(100/1,000/10,000Å) metallization.

It can be die-

mounted using Au/Sn eutectic preforms or a ther-

mally conductive epoxy.

The package surface

should be clean and flat before attachment.

Eutectic Die Attach:

A. An 80/20 Au/Sn preform is recommended with

a work surface temperature of approximately

255°C and a tool temperature of 265°C. When

hot 90/5 nitrogen/hydrogen gas is applied, sol-

der temperature should be approximately 290°

C.

B. DO NOT expose the MASW2000 to a tempera-

ture greater than 320°C for more than 20 sec-

onds. No more than 3 seconds of scrubbing

should be required for attachment.

Epoxy Die Attach:

A. Apply a minimum amount of epoxy and place

the MASW2000 into position. A thin epoxy fillet

should be visible around the perimeter of the

die.

B. Cure epoxy per manufacturer’s recommended

schedule.

C. Electrically conductive epoxy is recommended

but is not required.

Bonding

A. Ball or wedge bond with 1.0 mil diameter pure

gold wire. Thermosonic bonding with a nomi-

nal stage temperature of

150°C and a ball

bonding force of 40 to 50 grams or wedge

bonding force of 18 to 22 grams is recom-

mended. Ultrasonic energy and time should be

adjusted to the minimum levels necessary to

achieve reliable wirebonds.

B. Wirebonds should be started on the chip and

terminated on the package.

GND bonds

should be as short as possible; at least three

and no more than four bond wires from ground

pads to package are recommended.