| 数据搜索系统,热门电子元器件搜索 |
|
IO13PDB0V0 数据表(PDF) 19 Page - Microsemi Corporation |
|
|
|||||||||||||||||||||||||||||
IO13PDB0V0 数据表(HTML) 19 Page - Microsemi Corporation |
|
19 / 197 page ![]() SmartFusion Customizable System-on-Chip (cSoC) Re vi s i on 12 2 - 7 Thermal Characteristics Introduction The temperature variable in the SoC Products Group Designer software refers to the junction temperature, not the ambient, case, or board temperatures. This is an important distinction because dynamic and static power consumption will cause the chip's junction temperature to be higher than the ambient, case, or board temperatures. EQ 1 through EQ 3 give the relationship between thermal resistance, temperature gradient, and power. EQ 1 EQ 2 EQ 3 where θJA = Junction-to-air thermal resistance θJB = Junction-to-board thermal resistance θJC = Junction-to-case thermal resistance TJ = Junction temperature TA = Ambient temperature TB = Board temperature (measured 1.0 mm away from the package edge) TC = Case temperature P = Total power dissipated by the device Table 2-6 • Package Thermal Resistance Product θJA θJC θJB Units Still Air 1.0 m/s 2.5 m/s A2F200M3F-FG256 33.7 30.0 28.3 9.3 24.8 °C/W A2F200M3F-FG484 21.8 18.2 16.7 7.7 16.8 °C/W A2F200M3F-CS288 26.6 20.2 18.1 7.3 9.4 °C/W A2F200M3F-PQG208I 38.5 34.6 33.1 0.7 31.6 °C/W θJA TJ θA – P ------------------ = θJB TJ TB – P ------------------- = θJC TJ TC – P ------------------- = |
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |