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BLE112 数据表(PDF) 18 Page - List of Unclassifed Manufacturers

部件名 BLE112
功能描述  Bluetooth v.4.0, single mode compliant
PDF  31 Pages
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制造商  ETC2 [List of Unclassifed Manufacturers]
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标志 ETC2 - List of Unclassifed Manufacturers

BLE112 数据表(HTML) 18 Page - List of Unclassifed Manufacturers

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Bluegiga Technologies Oy
Page 18 of 31
5.2 Layout Guide Lines
Use good layout practices to avoid excessive noise coupling to supply voltage traces or sensitive analog
signal traces. If using overlapping ground planes use stitching vias separated by max 3 mm to avoid emission
from the edges of the PCB. Connect all the GND pins directly to a solid GND plane and make sure that there
is a low impedance path for the return current following the signal and supply traces all the way from start to
the end.
A good practice is to dedicate one of the inner layers to a solid GND plane and one of the inner layers to
supply voltage planes and traces and route all the signals on top and bottom layers of the PCB. This
arrangement will make sure that any return current follows the forward current as close as possible and any
loops are minimized.
Layout
Supply voltage
– If possible use solid power plane
– Make sure that solid GND plane follows the traces all the way
– Do not route supply voltage traces across separated GND regions so that the
path for the return current is cut
MIC input
– Place LC filtering and DC coupling capacitors symmetrically as close to audio
pins as possible
– Place MIC biasing resistors symmetrically as close to microhone as possible.
– Make sure that the bias trace does not cross separated GND regions (DGND ->
AGND) so that the path for the return current is cut. If this is not possible the do
not separate GND regions but keep one solid GND plane.
– Keep the trace as short as possible
Signals
GND
Power
Signals
Recommended PCB layer configuration
Figure 14: Typical 4-layer PCB construction
Overlapping GND layers without
GND stitching vias
Overlapping GND layers with
GND stitching vias shielding the
RF energy
Figure 15: Use of stitching vias to avoid emissions from the edges of the PCB
5.3 BLE112-A Layout Guide
For optimal performance of the antenna place the module at the corner of the PCB as shown in the figure 16.
Do not place any metal (traces, components, battery etc.) within the clearance area of the antenna. Connect
all the GND pins directly to a solid GND plane. Place the GND vias as close to the GND pins as possible. Use
good layout practices to avoid any excessive noise coupling to signal lines or supply voltage lines. Avoid
placing plastic or any other dielectric material closer than 5 mm from the antenna. Any dielectric closer than 5
mm from the antenna will detune the antenna to lower frequencies.



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